Much of the pioneering work in this technology was done by IBM. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls ( BGAs ), or terminations on the body of the component.īy the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation.īoth technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead.Īn electrical component mounted in this manner is referred to as a surface-mount device ( SMD ). The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. Smd Components Identification Manual Soldering Iron.
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